반도체 패키징
첨단 집적을 위한 글래스 인터포저 및 코어 웨이퍼 기술
YEKGLASS는 2.5D/3D IC, FOWLP, SiP를 비롯한 차세대 반도체 집적 기술에 최적화된 맞춤형 글래스 웨이퍼를 공급합니다.
글래스 플랫폼 특유의 높은 정밀도와 뛰어난 전기적·열적 신뢰성으로 패키징의 모든 레이어를 지원하며,
패널 레벨 패키징부터 글래스 코어 기판, 저CTE 기판에 이르기까지 주요 반도체 패키징 규격을 아우르는 솔루션을 제공합니다.
반도체 패키징을 혁신하는 글래스 기술
YEKGLASS는 첨단 반도체 패키징을 위한 초정밀 가공 글래스 웨이퍼를 공급합니다.
다층 적층, 모듈형 조립, 고밀도 RDL 빌드업 공정 솔루션을 지원하며, 독자적인 몰딩 기술로 금속 핀 임베딩을 구현합니다.
초평탄·저CTE 글래스 코어 기판은 패키징 전 공정에 걸쳐 탁월한 치수 안정성을 제공합니다.
2.5D & 3D IC Packages
TGV 및 전도성 엘리먼트가 내장된 글래스 웨이퍼를 통해 소형 모듈의 수직 집적, 고속 신호 전달, 효과적인 열 관리를 구현합니다.
Fan-Out Wafer-Level Packaging
초평탄 코어 글래스 기판이 재배선층(RDL)의 변형을 방지하고 정밀도를 유지해, 박형(Low-profile) 및 고비용 효율 패키지의 공정 정렬 신뢰성을 대폭 향상시킵니다.
System-in-Package
캐비티 구조의 글래스 웨이퍼는 완벽히 기밀 실링된 글래스 아키텍처 내부에서 RF, 센서, 메모리 등 다양한 기능성 모듈의 다기능 집적을 지원합니다.
RF, Optical & Power Modules
글래스 고유의 우수한 유전 안정성과 기밀 특성을 바탕으로 가혹한 작동 환경에서도 고주파 및 고전압 부품을 안정적으로 보호합니다.
Key Features & Advantages of Glass-Based Packaging
YEKGLASS applies decades of specialized glass manufacturing expertise to enhance the performance and reliability of semiconductor packaging solutions.
Our solutions deliver higher yields, better reliability, and a streamlined path toward next generation device designs.
Ultra-Precise Structuring
YEKGLASS uses proprietary glass molding and etching technologies to create micro scale features such as vias, cavities, channels, and edge defined structures with sub 30 μm accuracy. This precision allows complex integration with minimal edge chipping, making it ideal for MEMS, sensors, and high density IC packaging.
Thermal & Mechanical Stability
Instead of drilling vias and performing electroplating, we embed conductive metal pins during the glass wafer molding process. This single step approach minimizes mechanical stress, prevents microcracks, and ensures consistent pin to glass adhesion.
Dielectric Performance
Glass exhibits inherently low dielectric constant and low loss tangent, providing excellent electrical insulation and minimal signal interference at high frequencies. This makes it a superior material for RF modules, high speed signal lines, and optical communications where signal integrity is critical.
Hermetic & Reliable
With natural resistance to moisture, gas, and chemicals, glass substrates ensure true hermetic sealing protecting internal components from environmental damage. This reliability is essential in mission critical systems such as aerospace, medical, and high voltage electronics, where failure is not an option.
Why YEKGLASS
Our proprietary glass molding process forms TGV, cavities, and metal pins simultaneously in a single step.
This eliminates conventional drilling and electroplating, reducing process complexity and improving yield.
The result is better mechanical integrity and more consistent electrical performance across the packaging layer.
| Traditional Packaging | YEKGLASS Solution |
|---|---|
| Via drilling + plating needed | Direct metal pin molding in glass |
| High CTE mismatch with packaging layers | Low CTE glass ensures stress-free bonding |
| Organic core materials degrade over time | Glass provides hermetic, long-term reliability |
| Limited design flexibility | Custom cavities, vias, and wafer formats available |
Collaborate with YEKGLASS to engineer the next evolution in IC packaging.
Whether you need glass interposers, core substrates, or application-specific bonding support, our global team is ready to help you scale with confidence.
Discuss Your Packaging Requirements With Us
Glass-Based Platforms for Advanced Semiconductor Packaging
YEKGLASS offers reliable and customizable glass components engineered to support a wide range of packaging processes.
Discover the core platforms behind advanced semiconductor integration.
Low-temperature sealing materials based on glass compositions, suitable for bonding between glass, metal, or ceramic components. Available in powder or paste form, our materials provide strong adhesion, thermal durability, and hermetic sealing under optimized processing conditions. Ideal for forming protective seals in miniaturized devices and packaging units.
Glass Frit & Paste
Precision-processed glass wafers with through holes, custom cavities, and optional conductive feature integration. Using our proprietary glass forming technology, we provide platform wafers suitable for multi layer integration and signal routing in compact electronic modules. These wafers support high alignment accuracy, design flexibility, and process compatibility.
Micro Structured Glass Wafer
Glass wafers featuring custom cavity structures, stepped profiles, and sidewall shaping for device encapsulation and structural support. Their flatness and high dimensional control make them suitable for wafer level integration, sensitive device housing, and sealing applications.
Options such as optical transparency, surface polishing, and coating are available for diverse needs.
Packaging Glass Wafers
Looking for Precision and Reliability in Glass Packaging?
Tell us about your project goals or technical challenges. Let’s build it—exactly the way you need.