Glass Wafer Processing

Custom Glass Structuring — TGV, Cavity, and Hermetic Packaging Solutions

YEKGLASS provides glass wafer processing solutions for semiconductor, sensor, and MEMS applications.
Our capabilities cover precision microstructuring, hermetic packaging, and wafer-level packaging— supporting both 2.5D/3D architectures and cavity-based designs.

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Precision Glass Microstructures

Fabrication Methods

We offer two fabrication methods to support complex structural designs in glass wafers: molding-based forming and laser or etching-based microfabrication.
Available in borosilicate, aluminosilicate, and alkali-free glass compositions.
Standard wafer sizes from 2-inch to 8-inch, with thickness options from 0.2mm to 2.0mm and TTV under 5μm upon request.

Feature Molding Process Laser / Etching Process
Minimum Hole Diameter ϕ100 μm ϕ50 μm
Pitch and Density 100 μm or more, excellent uniformity High-density patterns with pitch below 50 μm
Structure Types Cavity, step wall, chamfered vias, full-depth holes Microvias, etched trenches, variable-depth cuts
Key Advantages No thermal damage, low internal stress High resolution, flexible design and depth
Limitations Requires mold tooling, less suitable for fine pitch Potential thermal stress, longer process times

We recommend the most appropriate method based on your structure layout, design goals, and production scale.

Integrated Glass Packaging for Next-Generation Devices

Cavity, Through-Via, and Metal Pin Integration in a Single Process

Our molding process allows not only structural shaping but also functional integration of conductive and mechanical features into glass wafers.

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  • Cavity structuring for MEMS and sensor sealing

  • Through Glass Via (TGV) formation for vertical signal transmission

  • Metal pin insertion using Cu or W pins ranging from ϕ100 μm to ϕ300 μm

  • Simultaneous forming of cavity, via, and metal pin in one molding process

This enables reliable, cost-effective, and space-saving packaging solutions with high hermeticity, electrical isolation, and thermal stability.

Supported Applications

From hermetic sensor caps to high-density interposers and optical platforms

Each design is engineered for dimensional accuracy and process compatibility, with support for both prototyping and volume production.
Our cavity-structured glass wafers are commonly used as hermetic cap wafers for MEMS pressure sensors, gyroscopes, and accelerometers.

Industry Application Case Description
MEMS & Sensor Sensor Cap Wafer Cavity-structured glass cap for pressure, motion
Semiconductor Package Glass Interposer Substrate TGV wafer with signal and power routing for 2.5D/3D integration
Advanced Packaging Core Glass in Multi-Stack Module Ultra-flat core substrate used in multilayer chip stacks
Optoelectronics Photonic Interface Platform Transparent substrate for optical alignment, waveguide coupling
Bio/Medical Device Wafer-Level Diagnostic Chip Structured wafer with wells and microfeatures for fluid analysis
Automotive Sensor Hermetic Glass with Metal Feedthrough Sensor enclosure with conductive pin insert for harsh environments
Display & LED Heat-Resistant Optical Substrate Flat, polished glass used under high thermal loads in LED
RF / Telecom RF Glass Interposer Glass substrate with low-loss vias for high-frequency signal routing

Our engineers can guide you through material selection, structural design, and fabrication method.
Let’s find the most effective solution for your application.

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Industry Coverage

Our structured glass wafers are applied across semiconductor, MEMS, sensor, and optical industries.

YEKGLASS glass wafer solutions are trusted across a wide range of industries.
Our core glass substrates provide ultra-flat, dimensionally stable platforms for redistribution layer build-up and multi-layer packaging integration.
Our technology enables next-generation performance through customized structures and specialized materials.

High-precision molded glass wafer featuring clean through-holes for 2.5D MEMS device encapsulation
Glass wafer featuring molded through-vias with embedded metal pins for vertical signal transmission in 2.5D packaging
Glass wafers with multiple cavity designs optimized for light emission, alignment, and encapsulation in LED or optical modules
Through-glass via wafer with vertical interconnect structure
Glass wafer with central cavity and alignment features for WLP
Molded glass wafer with cavities and microwells for controlled fluid flow in microfluidic applications
Hermetic glass packaging featuring robust glass-to-metal bonding for RF, radar, and telecom module integration
MEMS-compatible glass wafer featuring precision-drilled tapered holes at varying angles for optimized sensor alignment and sealing
High-durability carrier glass wafer with excellent thermal and chemical resistance, precisely processed for semiconductor handling
Glass interposer wafer with metal pin insert layout
Microstructured glass chip with integrated inlet/outlet ports and fluidic channels for biochemical analysis or lab-on-chip systems
Molded wafer with uniform pin holes for high-density connection
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Ready to build your next-generation substrate?

Share your drawings or layout requirements.
We’ll review your project and provide a custom wafer proposal with full technical support.

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