Precision Glass Engineering for MEMS & Sensor Packaging
Miniaturization, Performance, and Reliability with Advanced Glass Technologies
YEKGLASS provides glass materials and processing technologies specifically engineered for MEMS and sensor integration.
Our solutions cover hermetic sealing, CTE-matched bonding, and precision microstructuring — from prototyping to volume production.
Cutting-Edge Applications
MEMS and sensor devices require precise glass components for hermetic packaging, optical transmission, and stable bonding across extreme operating conditions.
YEKGLASS supports the following sensor applications with tailored glass materials and processing solutions.
Pressure Sensors
Glass cap wafers and frit-sealed housings provide hermetic enclosure for MEMS pressure sensors used in automotive and medical systems.
MEMS Gyroscopes
Low-temperature glass sealing protects gyroscope MEMS structures from moisture and vibration in drones, AR/VR, and robotics applications.
Gas Sensors
Chemically resistant glass substrates and windows support reliable gas detection in corrosive and high-temperature sensing environments.
Proximity Light Sensors
High-transmission glass windows and precision-cut lens covers enable accurate proximity and ambient light detection in compact sensor modules.
Why Glass for MEMS & Sensors
Glass plays a vital role in MEMS and sensor device packaging, serving as a key material in the integration of miniaturized and high performance components.
Its unique properties enable enhanced precision, reliability, and long-term durability in even the most demanding application environments.
Hermetic Protection
Glass frit bonding and anodic bonding create an airtight hermetic seal around MEMS components, isolating them from moisture, oxygen, and contaminants for long-term device stability.
CTE Matching
Engineered glass compositions allow thermal expansion tuning to match silicon, ceramics, and metals like Kovar-minimizing mechanical stress and preventing failure during thermal cycling.
Microstructuring
YEKGLASS's proprietary molding technology enables fabrication of TGV, cavities, and cap wafer structures — serving as hermetic cover glass for MEMS pressure sensors, gyroscopes, and accelerometers.
Chemical Durability
Glass materials retain their mechanical and chemical properties under extreme temperature, humidity, or corrosive gases making them ideal for demanding sensor applications.
Our low-temperature glass frit and bonding solutions are trusted for MEMS and sensor integration.
Contact us to discuss customized particle size, CTE matching, or compatibility with your process.
Ready to seal your sensor with precision?
Glass-Based Core Technologies for MEMS & Sensor Integration
YEKGLASS delivers specialized glass frit and micro structured wafer solutions tailored for sensor packaging and device integration.
From dissimilar material sealing to 2.5D/3D structural processing, our technologies enable precise and reliable fabrication for high performance applications.
YEKGLASS offers low temperature glass frits specifically designed for MEMS and sensor sealing applications. Our materials support hermetic sealing below 500°C and are ideal for bonding dissimilar materials-such as glass, metal, and ceramics-ensuring structural integrity and long-term reliability. Particle size distribution can be customized for your process, enabling precise thickness control and stable sealing layers.
Glass Frit for Hermetic Sealing
YEKGLASS utilizes proprietary molding and high precision processing technologies to fabricate advanced glass wafers for MEMS and sensor packaging. We support a wide range of 2.5D and 3D structural features-including cavities, through vias, and vertical walls-on glass substrates, offering design freedom and integration possibilities not achievable by conventional machining.
Micro Structured Glass Wafer
Custom glass wafers, tailored for your MEMS project.
From cavities to vias, we provide highly accurate microstructuring on glass substrates.
Let’s explore how our technology can support your next sensor or MEMS device.