Precision Glass Solutions for High-Power LED
High Reliability LED Packaging with Glass Based Materials
YEKGLASS delivers advanced glass based solutions for LED packaging that outperform conventional materials in heat, humidity, and optical stability.
From hermetic sealing to phosphor encapsulation, our low temperature glass technologies are designed to meet the highest demands of today’s LED applications.
Where Glass Makes a Difference in LED Packaging
As LED technology pushes for higher brightness, tighter color control, and longer lifespans, packaging materials must meet new levels of reliability.
YEKGLASS supports this evolution with robust inorganic materials engineered for extreme conditions and long-term optical clarity.
Automotive Lighting
Headlamps, DRL, tail lights require high thermal and mechanical stability.
Horticulture LEDs
Red & deep red LEDs for plant growth need phosphors with thermal protection.
COB Modules
Chip on board packages demand strong seals and consistent color output.
Medical & Industrial Lighting
Harsh environments call for moisture proof, temperature resistant sealing.
Why Use PiG - A Better Way to Stabilize Light
PiG (Phosphor-in-Glass) is a revolutionary alternative to silicone based phosphor binders.
By embedding phosphors in a low temperature glass matrix, we ensure superior resistance to heat, moisture, and aging critical for red and high power LEDs.
High Temperature Stability
Operates reliably under extreme thermal conditions. Perfect for high power LEDs that generate significant heat without risking performance degradation.
No Yellowing or Color Shift
Maintains original color over time. Ensures consistent color output even after prolonged use in harsh environments.
Optimized for Red Phosphors
Ideal match for sensitive red phosphor materials. Especially suited for CaAlSiN₃:Eu²⁺ and similar compounds requiring low processing temperatures.
Customizable Properties
Adjustable shape, thickness, and color coordinates. Engineered to meet specific design needs, including targeted CIE color bins and light uniformity.
Glass vs. Silicone
| Feature | YEK PiG + Glass Frit | Silicone (PDMS) |
|---|---|---|
| Max. Temp. Resistance | ~400 °C | ~150 °C |
| Moisture Resistance | Excellent | Moderate |
| Color Stability | High | Susceptible to yellowing |
| Red Phosphor Compatibility | Excellent | Weak |
| Mechanical Strength | High (rigid) | Low (flexible) |
| Optical Clarity Over Time | Maintained | Degrades with age |
| Processing Tolerance | Tight, repeatable | Varies by lot |
Which Material Lasts Longer?
Looking to improve thermal durability or optical performance in your LED applications?
Our team can support you with tailored glass solutions for next-gen lighting systems.
Let’s Build the Future of LED
LED packaging involves multiple sensitive materials from phosphors to substrates that may degrade at high processing temperatures.
YEKGLASS’s low temperature frits allow hermetic sealing at 300–350 °C, preventing thermal damage while maintaining strong adhesion and precise control.
This makes it especially suitable for next generation LEDs using red phosphors or COB assemblies.
Why Low Temperature Glass Frit
Phosphor in glass
Discover YEKGLASS’s cutting-edge solutions designed to improve optical performance in LED packaging.
From frit powders to custom engineered PiG chips, our portfolio supports scalable production and next gen designs.
Request a Quote or Schedule a Consultation
Need pricing, lead time, or technical documents for PiG or LED sealing frits?
Contact us to discuss your project requirements and get expert support.