고출력 LED 패키징을 위한 고정밀 글래스 솔루션
High Reliability LED Packaging with Glass Based Materials
YEKGLASS는 내열성, 내습성, 광학적 안정성 면에서 기존 소재를 압도하는 LED 패키징용 첨단 글래스 솔루션을 제공합니다.
기밀 실링부터 형광체 캡슐화에 이르기까지, 당사의 저온 글래스 기술은 최신 LED 응용 분야의 엄격한 요구조건을 완벽히 충족하도록 설계되었습니다.
YEKGLASS의 소재는 가혹한 환경에서도 뛰어난 내구성을 발휘하는 LED 봉지재 역할을 수행하며, 기존 실리콘 소재를 효과적으로 대체합니다.
LED 패키징의 차별화를 이끌어내는 글래스 기술
고휘도 구현, 정밀 색상 제어, 수명 극대화 등 LED 기술이 고도화될수록 패키징 소재 또한 한층 더 높은 수준의 신뢰성을 요구받고 있습니다.
YEKGLASS는 극한의 환경 조건 속에서도 장기적인 광학적 안정성을 유지하도록 설계된 무기 소재 솔루션을 바탕으로 차세대 LED 기술 혁신을 지원합니다.
Automotive Lighting
Headlamps, DRL, tail lights require high thermal and mechanical stability.
Horticulture LEDs
Red & deep red LEDs for plant growth need phosphors with thermal protection.
COB Modules
Chip on board packages demand strong seals and consistent color output.
Medical & Industrial Lighting
Harsh environments call for moisture proof, temperature resistant sealing.
PiG : 혁신적 광학 안정화 솔루션
PiG(Phosphor-in-Glass) 기술은 실리콘 기반 형광체 바인더의 한계를 뛰어넘는 차세대 대안입니다.
형광체를 저온 글래스 매트릭스 내에 내장함으로써, Red LED 및 고출력 LED가 요구하는 최고 수준의 내열성, 내습성, 장기 신뢰성을 구현합니다.
High Temperature Stability
Operates reliably under extreme thermal conditions. Perfect for high power LEDs that generate significant heat without risking performance degradation.
No Yellowing or Color Shift
Maintains original color over time. Ensures consistent color output even after prolonged use in harsh environments.
Optimized for Red Phosphors
Ideal match for sensitive red phosphor materials. Especially suited for CaAlSiN₃:Eu²⁺ and similar compounds requiring low processing temperatures.
Customizable Properties
Adjustable shape, thickness, and color coordinates. Engineered to meet specific design needs, including targeted CIE color bins and light uniformity.
Glass vs. Silicone
| Feature | Phosphor in Glass | Silicone (PDMS) |
|---|---|---|
| Max. Temp. Resistance | ~500 °C | ~150 °C |
| Moisture Resistance | Excellent | Moderate |
| Color Stability | High | Susceptible to yellowing |
| Red Phosphor Compatibility | Excellent | Weak |
| Mechanical Strength | High (rigid) | Low (flexible) |
| Optical Clarity Over Time | Maintained | Degrades with age |
| Processing Tolerance | Tight, repeatable | Varies by lot |
Which Material Lasts Longer?
Looking to improve thermal durability or optical performance in your LED applications?
Our team can support you with tailored glass solutions for next-gen lighting systems.
Start Your LED Glass Project With Us
LED packaging involves multiple sensitive materials from phosphors to substrates that may degrade at high processing temperatures.
YEKGLASS’s low temperature frits allow hermetic sealing at 300–350 °C, preventing thermal damage while maintaining strong adhesion and precise control.
This makes it especially suitable for next generation LEDs using red phosphors or COB assemblies.
Why Low Temperature Glass Frit
Phosphor in glass
YEKGLASS offers glass frit powders and custom PiG chips for LED packaging applications.
Our materials support both small-batch development and scalable volume production.
Request a Quote or Schedule a Consultation
Need pricing, lead time, or technical documents for PiG or LED sealing frits?
Contact us to discuss your project requirements and get expert support.