Glass Wafer Processing
맞춤형 가공 솔루션 — TGV, 캐비티(Cavity), 기밀 패키징
YEKGLASS는 반도체, 센서 MEMS 어플리케이션을 위한 글래스 웨이퍼 가공 솔루션을 제공합니다.
정밀 미세가공, 기밀 패키징, 웨이퍼 레벨 패키징 기술 역량을 바탕으로 2.5D/3D 아키텍처와 캐비티 설계까지 모두 지원하고 있습니다.
Precision Glass Microstructures
가공 방식
글래스 웨이퍼는 정밀한 구조 설계를 위해 몰딩 기반 성형과 레이저 에칭 기반 미세가공의 두가지 가공 방식으로 생산됩니다.
붕규산(Borosilicate), 알루미노규산염(AS : Aluminosilicate), 무알칼리 유리의 조성으로 제공되며,
표준 웨이퍼는 크기 2 ~ 8인치, 두께 0.2~2mm의 범위로, 요청에 따라 TTV 5μm 이하도 지원하고 있습니다.
| 항목 | 몰딩 가공 | 레이저 에칭 가공 |
|---|---|---|
| 최소 홀(Hole) 직경 | ϕ100 μm | ϕ50 μm |
| 간격(Pitch) 및 밀도 | 100 μm 이상, 우수한 균일성 | 50 μm 이하 간격의 고밀도 패턴 |
| 구조 type | Cavity, step wall, chamfered vias, full-depth holes | Microvias, etched trenches, variable-depth cuts |
| 주요 장점 | 열 손상 없음, 낮은 내부 응력 | 고해상도, 설계 및 깊이의 유연성 |
| 제한사항 | 몰드 제작 필요, 미세 간격(Pitch)에서 제한적 | 열응력 발생 가능, 공정 시간 증가 |
고객의 요구조건을 고려하여 구조 레이아웃, 설계 목표, 생산 규모 등에 최적화된 가공방식을 지원합니다.
Integrated Glass Packaging for Next-Generation Devices
Cavity, Through-Via, and Metal Pin Integration in a Single Process
Our molding process allows not only structural shaping but also functional integration of conductive and mechanical features into glass wafers.
Cavity structuring for MEMS and sensor sealing
Through Glass Via (TGV) formation for vertical signal transmission
Metal pin insertion using Cu or W pins ranging from ϕ100 μm to ϕ300 μm
Simultaneous forming of cavity, via, and metal pin in one molding process
This enables reliable, cost-effective, and space-saving packaging solutions with high hermeticity, electrical isolation, and thermal stability.
Supported Applications
From hermetic sensor caps to high-density interposers and optical platforms
Each design is engineered for dimensional accuracy and process compatibility, with support for both prototyping and volume production.
Our cavity-structured glass wafers are commonly used as hermetic cap wafers for MEMS pressure sensors, gyroscopes, and accelerometers.
| Industry | Application Case | Description |
|---|---|---|
| MEMS & Sensor | Sensor Cap Wafer | Cavity-structured glass cap for pressure, motion |
| Semiconductor Package | Glass Interposer Substrate | TGV wafer with signal and power routing for 2.5D/3D integration |
| Advanced Packaging | Core Glass in Multi-Stack Module | Ultra-flat core substrate used in multilayer chip stacks |
| Optoelectronics | Photonic Interface Platform | Transparent substrate for optical alignment, waveguide coupling |
| Bio/Medical Device | Wafer-Level Diagnostic Chip | Structured wafer with wells and microfeatures for fluid analysis |
| Automotive Sensor | Hermetic Glass with Metal Feedthrough | Sensor enclosure with conductive pin insert for harsh environments |
| Display & LED | Heat-Resistant Optical Substrate | Flat, polished glass used under high thermal loads in LED |
| RF / Telecom | RF Glass Interposer | Glass substrate with low-loss vias for high-frequency signal routing |
Our engineers can guide you through material selection, structural design, and fabrication method.
Let’s find the most effective solution for your application.
Need help choosing the right wafer structure?
Industry Coverage
Our structured glass wafers are applied across semiconductor, MEMS, sensor, and optical industries.
YEKGLASS glass wafer solutions are trusted across a wide range of industries.
Our core glass substrates provide ultra-flat, dimensionally stable platforms for redistribution layer build-up and multi-layer packaging integration.
Our technology enables next-generation performance through customized structures and specialized materials.
Ready to build your next-generation substrate?
Share your drawings or layout requirements.
We’ll review your project and provide a custom wafer proposal with full technical support.