Glass Frit Sealing for Hermetic Electronic Packaging
유리·세라믹·반도체 기판용 무연 저온 기밀 솔루션
YEKGLASS는 전자 패키징 영역 전반에서 기밀 실링이 가능한 무연(Pb-free) 글래스 프릿 소재를 개발·공급하고 있습니다.
700°C 이하의 소성온도에서 신뢰성 있는 접합을 구현하며, 스크린프린팅, 디스펜싱, 레이저 실링, 프리폼(Preform) 공정에 대응 가능합니다.
웨이퍼 레벨 본딩부터 MEMS 센서 및 광학 윈도우 패키징까지 적용 가능합니다.
What Is Glass Frit?
Glass frit is a fine glass powder used as a bonding and sealing material across electronics, semiconductors, and precision instruments.
When fired at temperatures between 300°C and 700°C, glass frit melts and forms a hermetic, chemically stable bond between substrates.
It is available in powder, paste, and preform formats — each suited to different deposition methods and production environments.
Primary applications include hermetic sealing, wafer-level bonding, MEMS packaging, ceramic-to-glass bonding, optical window sealing, and semiconductor packaging.
Sealing Applications Across Electronics
Glass frit sealing is used wherever long-term hermetic protection is critical for moisture-sensitive devices, sensors, and bonding between dissimilar substrates.
YEKGLASS materials support sealing across the following major application areas.
Wafer-Level Hermetic Bonding
Frit-sealed wafer bonding for semiconductor and MEMS packaging — including cavity sealing, vacuum encapsulation, and CTE-matched glass-to-silicon bonding processes.
MEMS & Sensor Sealing
Low-temperature glass frit seals pressure sensors, gyroscopes, and gas sensors with hermetic protection against moisture, vibration, and corrosive environments.
Ceramic & Specialty Glass Sealing
Engineered frit compositions for sealing AlN, zirconia, alumina, borosilicate, soda-lime, alkali-free, and quartz substrates — supporting CTE matching across a wide range of advanced ceramic and glass materials.
Process Equipment Window Sealing
Hermetic frit sealing of optical windows, viewports, and feedthroughs for semiconductor process equipment, vacuum chambers, and analytical instruments.
Why Glass Frit for Sealing
Glass frit sealing combines hermetic reliability with material flexibility, supporting bonding across glass, ceramic, and semiconductor substrates.
YEKGLASS formulations are optimized for stable, lead-free sealing at firing temperatures suited to sensitive electronic components.
Hermetic Reliability
Vitrified glass frit seals form gas-tight and moisture-tight barriers, protecting sensitive MEMS, sensor, and packaging components against long-term environmental exposure.
Lead-Free, Low Temperature Firing
RoHS- and REACH-compliant compositions enable sealing at firing temperatures from 300°C to 700°C, avoiding thermal damage to delicate device structures and replacing legacy Pb-based sealing glasses.
Broad Substrate Compatibility
Engineered for sealing across advanced ceramics (AlN, ZrO₂, Al₂O₃), specialty glasses (borosilicate, soda-lime, alkali-free, quartz), and silicon substrates. Each formulation is selected based on substrate chemistry, firing profile, and target sealing geometry — not CTE alone.
Custom Composition & Process Tuning
Tg, CTE, particle size (D50/D90), viscosity, and solid content are individually tuned to match your firing profile, screen printing line, or dispensing process — from prototype evaluation to mass production.
Whether it is sensor cavity laser sealing, wafer-scale screen printing, or preform placement for optical assemblies, the right frit composition and process are critical.
Our team works with you to match material, format, and method to your specific substrate and production environment.
Ready to find the right sealing solution for your application?
Sealing Processes & Application Methods
Matching the Right Process to Your Substrate and Device
Reliable frit sealing depends on more than glass composition alone.
The firing method, deposition technique, sealing geometry, and substrate type all influence the final hermetic performance.
YEKGLASS supports various firing and application methods to match each project’s operating environment and production process.
Firing Methods
Thermal Firing Sealing
Furnace or hot-press based sealing performed between 300°C and 700°C — the most widely used method for wafer-level bonding, cavity sealing, and ceramic-to-glass packaging. Compatible with both crystallizing and non-crystallizing compositions, and especially well suited for AlN, ZrO₂, Al₂O₃, borosilicate, alkali-free glass, and quartz substrates where uniform heating is achievable.
Laser-Assisted Sealing
Localized sealing using 808 nm or similar IR laser sources — enabling fast, low-thermal-load bonding without subjecting the entire device to elevated temperatures. Ideal for thermally sensitive components and tightly enclosed cavity structures. Requires laser-absorbing frit compositions developed specifically for the irradiation wavelength.
Application (Deposition) Methods
Screen Printing
The standard deposition method for volume production. Compatible with 300–325 mesh screens and 15–20 µm emulsion thickness, producing uniform seal lines suited to flat substrates and wafer-level patterning. Paste viscosity (typically 90~100 kcps @ 10 rpm) and solid content (70–80 wt%) are tuned to the customer's printing line.
Dispensing
Direct deposition of lower-viscosity paste through fine-gauge nozzles — used for non-standard geometries, prototype evaluation, and localized sealing on three-dimensional or pre-mounted assemblies. Suited to dot, line, or contour-following seal patterns.
Preform Placement
Pre-sintered, dimensionally controlled glass preforms positioned directly between substrates before firing. Offers consistent sealing volume, gap control, and assembly repeatability — well suited to optical window sealing, hermetic feedthroughs, and high-precision automated assembly.
Custom sealing solutions, matched to your application.
From low-temperature wafer bonding to ceramic substrate sealing, YEKGLASS provides material and process expertise across hermetic packaging applications.
Tell us about your substrate, your firing condition, and your sealing target — we'll guide you to the right material and format.