Glass Frit & Paste
Pb-Free, Low-Temperature Glass Sealing Materials for Advanced Electronics
YEKGLASS provides advanced glass frit powders, pastes, and preforms engineered for precision sealing and bonding in displays, semiconductors, sensors.
Our products are formulated with customizable compositions, particle sizes, and thermal properties to meet diverse application needs.
With excellent compatibility across glass, metal, and ceramic substrates, they enable robust hermetic sealing at low processing temperatures.
These materials ensure long-term reliability and performance, even under demanding environmental or operational conditions.
Product Highlights
Our glass frit and paste products are specially formulated for low-temperature sealing, offering excellent adhesion, hermeticity, and thermal compatibility across various materials.
Engineered for precision, these lead-free materials ensure reliable performance in OLEDs, MEMS, semiconductor devices, and optical assemblies.
Low Firing Temperature
Our frit and paste enable secure bonding at low temperatures, protecting sensitive components from thermal damage.
RoHS & REACH Compliant
All our materials are 100% lead-free, fully compliant with RoHS and REACH standards for global environmental safety.
Multiple Forms Available
Choose from powder, paste, or sintered preform formats, depending on your process requirements and equipment.
Tuned for Your Process
We tailor thermal expansion (CTE), glass transition temperature (Tg), and viscosity to perfectly match your specific application.
Typical Applications
Versatile Bonding & Sealing Across High-Tech Industries
YEKGLASS's glass frit and paste solutions are used across a wide range of electronics and photonics applications.
Our materials enable hermetic, low-temperature bonding between dissimilar substrates, ensuring long-term reliability in challenging environments.
| Industry | Application Use Cases |
|---|---|
| OLED / AMOLED | Rigid panel encapsulation, laser-sealed bonding, moisture and oxygen protection |
| MEMS & Sensors | Glass-to-metal and glass-to-ceramic sealing for pressure sensors, etc. |
| Semiconductor Packaging | Wafer-level bonding, cavity sealing, die attach, interposer applications |
| Optoelectronics & LEDs | LED cap and lens sealing, optical window attachment |
| High-Voltage Components | Electrical insulation, PN junction passivation, rectifier sealing with solder glass |
Custom Formulations
Tailored Glass Properties for Process Precision and Material Compatibility
YEKGLASS formulates each glass frit and paste solution with specific tuning to ensure optimal sealing performance, mechanical strength, and process integration.
From substrate bonding to printability, we fine-tune key parameters for your success.
CTE Matching
Each formulation is engineered with a controlled coefficient of thermal expansion to match bonding substrates such as SUS, ceramics, or other glasses.
Thermal Properties Control
We tailor Tg and Tx values to ensure stable bonding at low firing temperatures and to minimize thermal stress during sealing.
Particle Size Optimization
Our frits are available with custom D50, D90 distributions, ensuring balanced flow, surface uniformity, and adhesion for your application.
Viscosity & Solid Content
Paste formulations are adapted to your equipment, with viscosity and solid loading optimized for screen printing or dispensing.
Our team is here to help you select the optimal model based on your materials, bonding method, and firing conditions.
Send us your requirements and let our specialists provide tailored technical support.
Unsure which glass frit fits your application?
Available Models & Specifications
Our glass frit materials are available in a range of standard and customizable formulations to meet diverse application needs.
Each model is optimized for specific firing temperatures, thermal expansion, and processing conditions, ensuring compatibility with substrates such as glass, sus, and ceramics.
Both powder and paste formats are offered, and selected models are also available as preforms upon request.
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Glass Frit Powder is a finely milled glass material used as a base for bonding and sealing applications. It is typically customized in terms of particle size and thermal properties, allowing compatibility with various substrates such as glass, metal, and ceramics. Glass frits are often used in high-reliability applications requiring hermetic sealing or thermal expansion matching.
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Softening Point
Coefficient of Thermal Expansion
Particle Size Distribution(D50, D90)
Chemical Composition
Color / Transparency
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Glass Paste is a screen-printable or dispensable formulation consisting of Glass Frit Powder dispersed in an organic vehicle. It enables easy application on substrates and is suitable for precision sealing, insulating, or protective layers. Paste viscosity, solid content, and flow behavior can be tailored to the customer’s printing or dispensing process requirements.
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Viscosity
Solid Content(%)
Thixotropy / Flow Behavior
Drying Behavior
Compatibility with Substrate
Binder Burnout Profile
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Glass Preform is a shaped or patterned glass-based structure made from frit material, pre-sintered or thermally compressed into specific geometries. It offers excellent dimensional stability and is ideal for localized sealing or encapsulation applications. Preforms simplify assembly processes and improve consistency in high-precision electronic, optical, and sensor devices.
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Shape & Dimensional Accuracy
Thickness & Uniformity
Preform Density / Porosity
Surface Finish
Handling Properties
Request a Sample or Custom Quote Today
All models are available in flexible quantities to support both evaluation and production.
Tell us what you need, and we’ll prepare the right material, format, and delivery terms for your application.