Interposer Glass Wafer
Interposer wafers with penetrating electrodes can be manufactured with high accuracy and low cost
Application of interposer wafer
High-density semiconductor components can be manufactured by
a laminated structure by inserting conductors into glass.
Interposer wafer specification
We can implement various shapes according to customer requests.
:: Specifications ::
| A(Electrode Diameter) | φ200μm～(±50μm) |
| B(Electrode Pitch) | 350μｍ～(±50μm) |
| C(Cavity Diameter) | φ250μm～ |
| D(Cavity Depth) | 350μm～ |
| E(Cavity Taper) | 20°～ |
| Glass Material | Soda lime glass, Borosilicate glass |
| Electrode Material | Kovar, 42 Alloy, Tungsten |
Ensure strict product quality in accordance with SEMI standards.
We also respond to various customer requests.
| SPEC | 4inch | 5inch | 6inch | 8inch | 12inch |
| Diameter | 100±0.20mm | 125±0.20mm | 150±0.20mm | 100±0.20mm | 100±0.20mm |
| Edge | C0.1 (+0.1mm/-0.05mm) | ||||
| Thickness | User Specifications | ||||
| Total Thickness Variation(TTV) |
< 10μm | ||||
| Waviness | < 40μm | < 40μm | < 60μm | < 65μm | unspecified |
| Strain | < 40μm | < 40μm | < 60μm | < 75μm | < 100μm |
| Surface | Single Side Polishing, Double Side Polishing | ||||
| Notch | Possibility | ||||
| Other | Laser imprinting on wafer surface | ||||