Designed a glass substrate capable of wafer-level packaging (WLP) tailored to silicon wafers. High-precision, low-cost, and high-end variety of features tailored to the user's specifications.

Interposer wafers with penetrating electrodes can be manufactured with high accuracy and low cost.

Through the development of molds and techniques, 3D glass forming techniques that do not require polishing are being developed to produce 3D glass at low cost by controlling the transfer of mold surface and heat.

Glass pastes are made by homogeneously dispersing powder glass upon the vehicle.

The Low Melting Glass Paste is a glass paste that allows you to work at a lower temperature than any other glass paste. Since it can be worked below 350°C, it can be used as a transparent coating agent because it replaces resin encapsulation or has a transmittance of more than 80%.