Why us?
We are a member of
Strict in quality, always providing our customers with trust and assurance.
We strive to:
- Improve on our techniques and quality—continuously without compromise.
- Build systems that calculate and prevent possible issues in advance.
- Solve problems and achieve goals by actively communicating with our partners.
- Identify our roles, act responsibly and with diligence and respect.
Contact US
Frits and Sealants
Glass powders made without compromise
Glass Forming
Innovative methods to push the boundaries of glass and glass microstructuring
[Precision Glass Forming]
Glass forming technology that keeps up with even the most difficult standards.
Printing
Class-leading thermal transfer printing technology
Product
Glass Frit for AMOLED & OLED
Low temperature encapsulantion sealant for the OLEDs and laser encapsulation process of the OLED light. More →
Glass Frit for LED Encapsulation
We are developing “The transparent ceramic sealants for high-power, high-brightness LED” More →
Perovskite Solar Cells
Promising a more durable bond for upcoming solar cells. More →
Glass Slide for Microfluidics
YEK Glass offers a large range of glass substrate wafers for a wide variety of industries. More →
Glass Wafer for MEMS Sensor
Ultra precise forming for glass wafers using our unique process allows for previously impossible designs. More →
FAQ’S & News
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What is glass frit ?
Glass frit is glass powder used as a sealant or as a means to bond glass wafers.
YEK Glass specializes in Pb-free (lead free) frit glasses for use in low temperature applications, prioritizing bonding strength and hermeticity as well as transparency. It is available as a paste, powder, or preform.
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What is the difference between glass sealing material and resin sealing materials?
Glass sealing material has better durability and heat resistance than resin sealing materials.
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What is a laser sealing?
Whereas typical sealing methods require the whole component to be heated, laser sealings is localized, allowing for sealing to occur only where the bonds are necessary.
The result is quicker bond without causing thermal damage to non-sealed portions of the device.