Precision Glass Engineering for MEMS & Sensor Component
Miniaturization, Performance, and Reliability with Advanced Glass Technologies
YEKGLASS offers tailored glass materials and processing technologies to meet the growing demands of MEMS and sensor integration.
Our advanced solutions support miniaturization, hermeticity, and performance reliability under extreme conditions.
Cutting-Edge Applications
Modern industries and consumer products demand ever smaller, smarter, and more reliable sensor systems.
YEKGLASS supports these needs through high precision glass processing and bonding technologies for the following key applications:
Pressure Sensors
Ideal for airtight packaging in automotive and medical applications
MEMS Gyroscopes
Enables accurate motion sensing in drones, AR/VR devices, and robotics
Gas Sensors
Chemically stable glass suitable for harsh sensing environments
Proximity Light Sensors
Ultra clear glass windows and lens covers for enhanced optical performance
Why Glass for MEMS & Sensors?
Glass plays a vital role in MEMS and sensor device packaging, serving as a key material in the integration of miniaturized and high performance components.
Its unique properties enable enhanced precision, reliability, and long-term durability in even the most demanding application environments.
Hermetic Protection
Glass sealing creates an airtight barrier around MEMS components, effectively isolating them from moisture, oxygen, and other contaminants for long-term device stability and reliability.
CTE Matching
Engineered glass compositions allow thermal expansion tuning to match silicon, ceramics, and metals like Kovar-minimizing mechanical stress and preventing failure during thermal cycling.
Microstructuring
YEKGLASS’s proprietary molding and forming technologies enable sub micron fabrication of through glass vias (TGV), cavities, and micro walls ideal for complex MEMS integration.
Durability in Harsh
Glass materials retain their mechanical and chemical properties under extreme temperature, humidity, or corrosive gases making them ideal for demanding sensor applications.
Our low-temperature glass frit and bonding solutions are trusted for MEMS and sensor integration.
Contact us to discuss customized particle size, CTE matching, or compatibility with your process.
Ready to seal your sensor with precision?
Glass-Based Core Technologies for MEMS & Sensor Integration
YEKGLASS delivers specialized glass frit and micro structured wafer solutions tailored for sensor packaging and device integration.
From dissimilar material sealing to 2.5D/3D structural processing, our technologies enable precise and reliable fabrication for high performance applications.
YEKGLASS offers low temperature glass frits specifically designed for MEMS and sensor sealing applications. Our materials support hermetic sealing below 500°C and are ideal for bonding dissimilar materials-such as glass, metal, and ceramics-ensuring structural integrity and long-term reliability. Particle size distribution can be customized for your process, enabling precise thickness control and stable sealing layers.
Glass Frit for Hermetic Sealing
YEKGLASS utilizes proprietary molding and high precision processing technologies to fabricate advanced glass wafers for MEMS and sensor packaging. We support a wide range of 2.5D and 3D structural features-including cavities, through vias, and vertical walls-on glass substrates, offering design freedom and integration possibilities not achievable by conventional machining.
Micro Structured Glass Wafer
Custom glass wafers, tailored for your MEMS project.
From cavities to vias, we provide highly accurate microstructuring on glass substrates.
Let’s explore how our technology can support your next sensor or MEMS device.