Glass Wafer

                    

“Glass Wafers”

2015 New challenge at New Industry Semiconductor & Automotive components.

Application Wafer-level Chip Scale PackageGlass interposer Si wafer carrier

Thinner Glass processing

Material Quartz Soda limeBorosilicate(Eagle XG/Borofloat 33)

Alkali free glass

Diameter (mm) 50(2″) – 500(20″)
Thickness (μm) 300-15,000
TTV (μm) ≤2 (standard) / ≤1 available
Polishing grade Regular / Optic grade /Special grade
SEMI flat/notch (mm) SEMI spec.
Edge Grinding C-shape, R-shape
Chamfering Optimized chamfer profile for glass wafers (SEMI spec.)
Edge exclusion zone 6 mm
Packaging Clean room packaging
Packaging unit Min. 10 pieces