Glass wafer for MEMS(TGV)

                    

Our distinctive glass molding and processing technology offer unique solutions for the semiconductor and MEMS industries. YEK GLASS is known globally for our customer focus and partnership by delivering cutting edge products.

1. Via Hole Type

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Our unique molding process can produce various shapes of Glass wafer’s Via Hole
For example, circle, rectangle, and triangle shape.
Depending on the customer’s various applications, Via Hole’s taper angle can be produced in various ways.

• Appearance of Wafer 

• Hole Shapehole shape

• Hole Angle

(Adjustable as Customer’s Demands)

• Cross section of Hole

• Specifications

External dimensions Below 9 inches
Diameter of via Round  ≤0.5mm(≤0.3mm)Square ≤0.7mm
Depth of via ≤1.2mm
Pitch of via ≤2.85mm(Under development of under 2.85mm)
Taper top to bottom via ≤10˚(Under development of 5˚ taper)
Glass material  [Borosilicate Glass]

Schott BorofloatⓇCorningⓇ Eagle XG™

[Aluminosilicate Glass]

Corning Gorilla Series

Schott Sensation Series

Asahi Dragon Trails

[Sodalime Glass]

NSG Glanova

2. Cavity Type

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• Specifications

External dimensions Below 9 inches
Diameter of Cavity Round  ≤0.5mm(≤0.3mm)Square ≤0.7mm
Taper top to bottom via ≤10˚(Under development of 5˚ taper)
Glass material  [Borosilicate Glass]

Schott BorofloatⓇCorningⓇ Eagle XG™

[Aluminosilicate Glass]

Corning Gorilla Series

Schott Sensation Series

Asahi Dragon Trails

[Sodalime Glass]

NSG Glanova