Our proprietary glass molding and processing technology offers unique glass micro-structuring solutions for the semiconductor, MEMS, and biotech industries. YEK Glass is known globally for focusing on our customers and creating partnerships by delivering cutting edge products.
1. Via Hole Type
Our proprietary molding process can produce glass vias in a wide range of shapes and sizes, such as circles, rectangles, and triangles.
YEK Glass’ molding technology also allows for precise control of through glass vias and cavity side wall angles, allowing your products to go beyond the limits that traditional processing techniques (such as laser drilling, ultrasonic drilling, or chemical etching).
• Wafer / Glass Substrate Shapes
• Wide Range of Shapes for Holes and Microstructures
(Customs shapes are possible, please inquire for details)
• Precision Controlled Sidewall Angle
(Can range from 2°-60°+ to match your needs, please inquire for details)