Glass wafer for MEMS(TGV)


Our  proprietary glass molding and processing technology offers unique glass micro-structuring solutions for the semiconductor, MEMS, and biotech industries. YEK Glass is known globally for focusing on our customers and creating partnerships by delivering cutting edge products.

1. Via Hole Type


Our proprietary molding process can produce glass vias in a wide range of shapes and sizes, such as circles, rectangles, and triangles.
YEK Glass’ molding technology also allows for precise control of through glass vias and cavity side wall angles, allowing your products to go beyond the limits that traditional processing techniques (such as laser drilling, ultrasonic drilling, or chemical etching).

• Wafer / Glass Substrate Shapes

• Wide Range of Shapes for Holes and Microstructures 

(Customs shapes are possible, please inquire for details)

hole shape

• Precision Controlled Sidewall Angle

(Can range from 2°-60°+ to match your needs, please inquire for details)

• Microstructure Cross Sections

(Stepped sidewalls and posts are possible)

2. Cavity Type


• Specifications

External dimensions Below 9 inches
Diameter of via Round  ≤0.5mm(≤0.3mm)Square ≤0.7mm
Depth of via ≤1.2mm
Pitch of via ≤2.85mm(Under development of under 2.85mm)
Taper top to bottom via ≤2˚
Glass material  [Borosilicate Glass]

Schott BorofloatⓇ

CorningⓇ Pyrex™

[Aluminosilicate Glass]

Corning Gorilla Series

Schott Sensation Series

Asahi Dragon Trails

[Sodalime Glass]

NSG Glanova