Glass wafer for MEMS(TGV)

                    

Our distinct glass molding and processing technology offers unique glass micro-structuring solutions for the semiconductor, MEMS, and biotech industries. YEK GLASS is known globally for focusing on our customers and creating partnerships by delivering cutting edge products.

1. Via Hole Type

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Our proprietary molding process can produce glass vias in a wide range of shapes and sizes, such as circular, rectangular, and triangular shapes.
YEK Glass’ molding technology also allows for precise control of through glass vias and cavity side wall angles, allowing your products to go beyond the limits that traditional processing techniques (such as laser drilling, ultrasonic drilling, or chemical etching).

• Appearance of Wafer 

• Hole Shapehole shape

• Hole Angle

(Adjustable as Customer’s Specifications)

• Cross section of Hole

• Specifications

External dimensions Below 9 inches
Diameter of via Round  ≤0.5mm(≤0.3mm)Square ≤0.7mm
Depth of via ≤1.2mm
Pitch of via ≤2.85mm(Under development of under 2.85mm)
Taper top to bottom via ≤2˚
Glass material  [Borosilicate Glass]

Schott BorofloatⓇCorningⓇ Eagle XG™

[Aluminosilicate Glass]

Corning Gorilla Series

Schott Sensation Series

Asahi Dragon Trails

[Sodalime Glass]

NSG Glanova

2. Cavity Type

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• Specifications

External dimensions Below 9 inches
Diameter of Cavity Round  ≤0.5mm(≤0.3mm)Square ≤0.7mm
Taper top to bottom via ≤2˚
Glass material  [Borosilicate Glass]

Schott BorofloatⓇCorningⓇ Eagle XG™

[Aluminosilicate Glass]

Corning Gorilla Series

Schott Sensation Series

Asahi Dragon Trails

[Sodalime Glass]

NSG Glanova